서지주요정보
Bonding in Microsystem Technology [electronic resource]
서명 / 저자 Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.
저자명 Dziuban, Jan A
단체명 Dziuban, Jan A
발행사항 Dordrecht : Springer Netherlands, 2006.
총서명 Springer Series in Advanced Microelectronics, 1437-0387 ; 24
Online Access http://dx.doi.org/10.1007/1-4020-4589-1URL

서지기타정보

서지기타정보
청구기호 TA405-409.3
형태사항 XVIII, 334 p. online resource.
언어 English
내용 Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks.
주제 Engineering.
Continuum mechanics.
Industrial engineering.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Engineering.
Continuum Mechanics and Mechanics of Materials.
Engineering, general.
Optical and Electronic Materials.
Electronics and Microelectronics, Instrumentation.
Operating Procedures, Materials Treatment.
보유판 및 특별호 저록 Springer eBooks
ISBN 9781402045899
기타 표준번호 10.1007/1-4020-4589-1
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