서지주요정보
실리콘 마이크로선 표면의 화학적 식각을 이용한 요철 생성 및 이를 수소 가스 탐지에 적용하는 방법에 관한 연구 = surface roughening of silicon microwire by chemical etching and its application to hydrogen sensor
서명 / 저자 실리콘 마이크로선 표면의 화학적 식각을 이용한 요철 생성 및 이를 수소 가스 탐지에 적용하는 방법에 관한 연구 = surface roughening of silicon microwire by chemical etching and its application to hydrogen sensor / 김형균.
발행사항 [대전 : 한국과학기술원, 2019].
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8033527

소장위치/청구기호

학술문화관(문화관)B1층 보존서고

MME 19001

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In this work, we explored palladium-catalyzed chemical etching of silicon surface to create nanoscale roughness and its application to silicon thin film gas sensors to achieve low-cost and high-performance hydrogen gas sensors. Metal-assisted chemical etching (MaCE) is a method that is commonly used to form vertically aligned silicon nanowires or porous silicon surfaces on bulk silicon wafers. However, in this master’s thesis, we applied MaCE to form nano-pores with the diameter of tens-of-nanometers on the surface of the silicon. Firstly, densly packed nanoscale palladium nanoparticles were deposited on the silicon surface by an E-beam evaporator (deposition thickness: 1 nm / 2 nm). To modulate the size and spacing of palladium nanoparticles, the nanoparticles on the silicon surface were dewetted by the rapid thermal annealing process (600℃, 5 min, vacuum $1∙10^{-2}$ torr, $N_{2}$ gas flow of 10 sccm). Then, MaCE was performed for a short period in the etching solution mixed with deionized water, hydrofluoric acid, and hydrogen peroxide. As a result, we confirmed that the short-term chemical etching of silicon surface catalyzed by palladium nanoparticles cause the creation of nanoscale roughness. Particularly, if the palladium nanoparticles were dewetted before the etching, it results in a clearer roughness to obtain a higher surface-to-volume ratio. By applying this method to a silicon thin-film hydrogen gas sensor, we deomnstrated that the sensitivity of the sensor is significantly improved compared to the flat silicon thin film sensor. For 0.1% of $H_{2}$ gas concentration, the sensitivity of the sensor was increased from 4.36% to 294%, which is 67.4 times higher.

본 연구에서는 팔라듐 나노입자를 촉매로 실리콘 표면을 화학적으로 식각하여 나노 크기의 요철을 생성하고 이를 실리콘 박막 가스 센서에 응용하여 저비용, 고성능의 가스 센서를 구현하였다. 금속촉매화학식각법 (Metal-assisted Chemical Etching, MaCE)은 벌크 실리콘 웨이퍼에 수직으로 정렬된 실리콘 나노선 다발 혹은 다공성 실리콘 표면을 형성하는 기법이다. 본 석사학위논문에서는 이를 응용하여 실리콘 표면에 수십 나노 크기의 요철을 형성하고자 하였다. 먼저, 전자빔 증착기를 이용하여 (증착 두께: 1 nm / 2 nm) 실리콘 표면에 수 나노미터 크기의 촘촘하게 배열된 팔라듐 나노입자들을 형성하였다. 팔라듐 나노입자들의 크기와 간격 조절을 위하여 팔라듐 나노입자들이 형성된 실리콘 기판에 급속열처리를 통해 나노입자들을 디웨팅 (dewetting)시켰다 (600℃에서 5분, 진공도 $1∙10^{-2}$ torr, 질소 가스 10 sccm으로 흘려줌). 그 후, 초순수와 불화수소산, 과산화수소수를 (5000:500:1)의 비율로 혼합한 식각 용액에서 25초 동안 MaCE를 진행하였다. 그 결과, 실리콘 표면에 형성된 팔라듐 나노입자를 촉매로 하여 짧은 시간 동안 화학적 식각한 결과 나노 크기의 요철이 생성됨을 확인하였으며, 특히 식각 전 팔라듐 나노입자들을 디웨팅시켰을 경우 더 확실한 표면 요철을 생성하여 높은 단위 체적당 표면적 비율을 얻을 수 있었다. 이를 실리콘 박막 가스 센서에 적용하여 수소 가스 센서로 이용하였을 때, 기존의 평판 실리콘 박막 센서에 비하여 센서의 감도면에서 매우 향상됨을 확인하였다. 수소 0.1% 농도의 가스 기준으로 센서의 감도가 4.36%에서 294%로 약 67.4배로 향상되었다.

서지기타정보

서지기타정보
청구기호 {MME 19001
형태사항 v, 47 p. : 삽화 ; 30 cm
언어 한국어
일반주기 저자명의 영문표기 : Hyeonggyun Kim
지도교수의 한글표기 : 박인규
지도교수의 영문표기 : Inkyu Park
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학과,
서지주기 참고문헌 : p. 42-44
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(a) Schematic image ofPd-SnO2 gas sensor, (b) SEM image ofPdloaded SnO2 nanowires. [19]

(a) schematic of silicon nanowire H2 gas sensor with Pd nanoparticle decoration and side gate, (b) schematic of working principle ofH2 sensing in the Pd-decorated silicon nanowire, (c) SEM images of the fabricated device [22]

Schematic diagram ofprocesses and characteristic energies in nucleation and growth on surfaces [31]

The three modes of film growth: (a) Frank-van der Merwe, (b) Volmer-Weber, and (c) Stransky- Karastanov [34]

(a)schematic ofPdNP decoration on thinSifilm,(b,c)as-deposited PdNPsonSibyE-beam evaporator with the depostion thickness of1 nm, and 2 nm, respectively

(a) Surface energy equilibrium diagram, (b) Schematic ofsolid-state dewetting ofthin film [36]

Dewetting schematic ofPdNPs: densely packed, as-deposited PdNPs (left)by E-beam evaporation and annealed Pd NPs by RTA instrument (right)

(a) typical RTA instrument with halogenlamp system, (b)intended temperature profile for RTAprocess: heating rate by20'C/s, 600'C in 5 min, cooling by natural convection.

(a) schematic ofdewetted PdNP on thin Sifilm,(b, c)PdNPson Siafter annealing with deposition

SIMS analysis data for Si and Pd of(a) as deposited Pd NPs on Si, and (b) annealed PdNPs on Si

XRD (2 theta) profiles ofthe Pd(1 nm)/Si (100) systems (a) without annealing, and (b)after annealing at 600'C

(a) SEM images ofp-Si(100) sample for different etchant ratio, (b) Etch rate as a function ofthe molar

SEM images of(a) as-deposited Pd NPs on Siby E-beam evaporation (deposition thickness of1

SEM images of(a) as-deposited Pd NPs on Siby E-beam evaporation (deposition thickness of2

Cross-section image of(a) chemically etched Si with as-deposited Pd NPs (2 nm) after immersing in the etching solution for 30seconds, (b) chemically etched Si with annealed Pd NPs (2 nm) afterimmersing in the

XPS binding energy plot ofPd3d peak for (i) Pd NP decorated Si, (ii) Pd NP decorated Si after nroeece and P1 NPdecorated C: afterRTA neoceee and M2CF

Target specifications for hydrogen sensors [43]

(a) Schematic ofvertically aligned Pd-coated Si NW arrays, and (b) cross-sectional view SEM image

(a) Optical microscope image ofa3.5-nm-thin silicon transistor, (b)schematic illustration, (c) detailed

Sensing mechanism ofthe Pd-Si hydrogen sensor

Band diagram of(a) Pd-Si interface in ambient air, and (b) Pd-Si interface exposed to H2 gas

Sensing mechanism ofthe Pd-Si hydrogen sensor with MaCE

The measured Schottky barrier height, Pb,as a function ofthe Pauling electronegativity forn-type Si nethlilimalidtn-semicnm.co and metal-semiconductor (M-S) devices [47]

Schematic ofthe setups for a gas detection test

Fabrication Scheme for Pd-Si thin film sensor: (a) channel formation by RIEand ion implantation, (b)

dynamic real-time response ofPd-Si sensor

Fabrication Scheme for Pd-Si, MaCE thin film sensor: (a) channel formation by RIE and ion implantation, (b)Pd decoration, (c) preferential MaCE etching ofSi channel for 30sec

dynamic real-time response ofPd-Si, MaCE sensor

Schematics of fabrication process for Annealed Pd-Si, MaCE hydrogen sensor: (a) Si channe

-V curve of(a) pristine Si, Pd-Si, Annealed Pd-Si, and Annealed Pd-Si with MaCE,(b)I-V curve of Annealed Pd-Si with MaCE

Optical microscopic imageof(a) Pd-Si sensor, and (b) Annealed Pd-Si, MaCE sensor

dynamic response of Pd NP decorated Si after RTA process and MaCE to

Sensingresponse offabricated sensors upon H2 exposure for different concentrations: (a)dynamic real- time response ofsensors (Pd-Si, Pd-Si, MaCE, and annealed Pd-Si, MaCE) to gas flow of0.1%,0.2%, 0.5%, and

Gas response ofPdNP decorated Si film sensor after RTA process and MaCE upon

Dynamic response to 0.1-0.8% ofH2 gas for4 different sensors

Statistical plotfor H2 concentration - Response and calibration