서지주요정보
유전 경화 모니터링을 이용한 후판 복합재료의 스마트 성형 기법 = Smart cure process for thick composites using dielectric cure monitoring
서명 / 저자 유전 경화 모니터링을 이용한 후판 복합재료의 스마트 성형 기법 = Smart cure process for thick composites using dielectric cure monitoring / 김형근.
저자명 김형근 ; Kim, Hyoung-Geun
발행사항 [대전 : 한국과학기술원, 2003].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014684

소장위치/청구기호

학술문화관(문화관) 보존서고

DME 03063

휴대폰 전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material has been performed for improving quality and productivity during manufacturing. The dissipation factor measured by dielectrometry is dependent on both the degree of cure and temperature of resin. Therefore, in this study, a new method to obtain the degree of cure without temperature effect during on-line cure monitoring for glass/polyester and glass/epoxy composites was developed by employing a combination function of the temperature and the log dissipation factor. The elimination method removed the effects due to resistance and capacitance from the external cable, and consequently improved the sensitivity of cure monitoring. The temperature signal was measured with a K-type thermocouple and the dissipation factor signal was measured with an interdigital dielectric capacitance (IDC) sensor during curing process. Then the calculated degree of cure using the measured data from dielectrometry was compared to the measured value from DSC. The developed on-line cure monitoring method was applied to a 2-step cure cycle and a cooling-reheating cure cycle during the cure of planar thick composite laminates for the verification of the developed procedure. Residual strains were measured using bore out experiment for axi-symmetric carbon/phenolic thick composites, and residual stresses were calculated from piecewise elimination of elements in FE analysis. The formation of wrinkle and void was eliminated by adapting radial expansion mechanism and modification of the cure cycle. In conclusion, the reliability of manufacturing of thick composites was improved from the application of cure monitoring technique during autoclave vacuum bag molding process.

서지기타정보

서지기타정보
청구기호 {DME 03063
형태사항 x, 105 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Hyoung-Geun Kim
지도교수의 한글표기 : 이대길
지도교수의 영문표기 : Dai-Gil Lee
수록잡지명 : "Dielectric cure monitoring for glass/polyester prepreg composites". Composite structures, v.57 nos.1-4, pp.91-99 (2002)
학위논문 학위논문(박사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 98-105
주제 유전
경화
후판
복합재료
성형
dielectric
cure
thick
composites
process
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