서지주요정보
알루미늄과 이종소재의 접합공정 및 접합기구 = Joining process and bonding mechanism between aluminum and dissimilar metals
서명 / 저자 알루미늄과 이종소재의 접합공정 및 접합기구 = Joining process and bonding mechanism between aluminum and dissimilar metals / 손웅희.
저자명 손웅희 ; Sohn, Woong-Hee
발행사항 [대전 : 한국과학기술원, 2003].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014347

소장위치/청구기호

학술문화관(문화관) 보존서고

DMS 03003

휴대폰 전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The microstructures and liquid state diffusion bonding mechanism of cp-Ti to pure Al using an Al-10.0wt%Si-1.0wt%Mg insert metal with 100μm in thickness have been investigated at 620℃ under 1 × $10^{-4}$ torr. The effects of bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, SEM and EPMA. The interfacial bond strengths of Al/Ti bonded joints were measured by the single lap shear test. The results show that the bonding at the interface between Al and insert metal proceeds by wetting the Al with molten insert metal, and followed by removal of oxide layer on surface of Al. The interface between Al and insert metal moved during the isothermal solidification of insert metal by the diffusion of Si from insert metal into Al layer. The interface between Al and insert metal became curved in shape with increasing the bonding time due to capillary force at grain boundaries. The bonding at the interface between Ti and insert metal proceeds by the formation of two different intermetallic compound layers, identified as $Al_5Si_{12}Ti_7$ and $Al_{12}Si_3Ti_5$, and followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing the bonding time up to 25 minutes at 620C. However, the interfacial bond strength of Al/Ti joint decreased after bonding time of 25 minutes at 620℃ due to formation of cavities in Al near Al/intermetallic interfaces. The microstructures and solid state diffusion bonding mechanism of 1060 Al and Zr has been investigated in the temperature range from 400 to 500℃ with increasing the pressure from 5 MPa to 80MPa and pressure time from 1 to 180 minutes. When the pressure was applied in the initial stage under the experimental conditions, the asperities formed on the surface were plastically deformed and the oxide layers were damaged. When the bonding proceeded, the parts that were not contacted in the initial stage contained thin, lenticular voids. As the bonding time increased, the shape of voids was changed into spherical in order to reduce the interfacial energy. Finally, these spherical voids are gradually eliminated by creep deformation and duffusion process. The bond strength increased with increasing the bonding temperature, pressure and bonding time. Three methods were proposed to improve the bonding characteristics. Firstly, bond strength increased by disruption of surface oxide by increasing pressure. Secondly, the bond strength increase with increasing the surface roughness by damage of surface oxide and strong mechanical locking phenomena. Finally, bond strength increased at the level of 80% of strength of Al base metal by formation of intermetallic compounds by interdiffusion between Al and Zr. From the results of the heat treatment to 400 hours at the range of 450℃- 550℃, two phases, i.e., $Al_3Zr$ phase and $Al_2Zr$ phase, was characterized by performing EDS analysis and XRD experiments. The growth of $Al_3Zr$ intermetallic compound was observed as an important phenomenon to understand the reaction at the interface between Zr and Al. The growth rate of $Al_3Zr$ intermetallic compound was controlled by diffusion process and the activation energy for growth of $Al_3Zr$ phase was 214 kJ/mol. It was suggested that the growth mechanism of $Al_3Zr$ phase was diffusion of Zr in Al. In order to analyse the bonding characteristics, the modeling for solid state diffusion bonding was suggested and it was possible to predict the bonding process time from these model. Assumption was follows; Al was plastically deformed by ridge to ridge contact and cylinrical pores were uniformly distributed along the bonded interface. And the pore closure was accomplished by a combination of creep deformation by hystrostatic stress around pores and diffusion process. From this model, it was possible to predict the bonding time with increasing the bonding area fraction. And the theoritical results were in good agreement with the measured results.

서지기타정보

서지기타정보
청구기호 {DMS 03003
형태사항 xii, 160 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Woong-Hee Sohn
지도교수의 한글표기 : 홍순형
지도교수의 영문표기 : Soon-Hyung Hong
수록잡지명 : "Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal". Materials science and engineering A
학위논문 학위논문(박사) - 한국과학기술원 : 재료공학과,
서지주기 참고문헌 : p. 156-160
주제 액상 확산 접합
삽입 금속
고상 확산 접합
접합 기구
크리프 변형
liquid state diffusion bonding
insert metal
solid state diffusion bonding
bonding mechanism
creep deformation
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