The distortion of the membrane in X-ray lithography is increasingly important as the integration density gets higher. It comes from several different sources such as fabrication processes, fixturing, X-ray exposure and so on.
In this thesis, an analysis procedure of the distortion by FEM is established and numerically illustrated. Gravity, heat due to X-ray exposure and radiation damage make patterns to be distorted. The higher Young's modulus is, the smaller the deformation of the membrane is. Deformation induced by the difference of thermal expansion coefficient between the membrane and its supporting Pyrex ring can be reduced by adjusting the temperature of anodic bonding. A method of analyzing the transient behavior due to a scanning X-ray is also suggested and sample calculations made.
The pattern distortions and the amount of the resulting blur induced during a writing period are calculated and individual contributions of each load are discussed. Although tuning of the models and their verification is not studied extensively, the preliminary results have indicated general tendencies.
