서지주요정보
LCD 패키징용 이방성전도필름의 전기전도기구와 신뢰성에 관한 연구 = A study on the electrical conduction mechanism and reliability of anisotropically conductive films(ACFs) for LCD packaging applications
서명 / 저자 LCD 패키징용 이방성전도필름의 전기전도기구와 신뢰성에 관한 연구 = A study on the electrical conduction mechanism and reliability of anisotropically conductive films(ACFs) for LCD packaging applications / 임명진.
저자명 임명진 ; Yim, Myung-Jin
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007469

소장위치/청구기호

학술문화관(문화관) 보존서고

MMS 97029

휴대폰 전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The requirements for better resolution and color quality LCD panels need advanced LCD packaging technology because of higher numbers of pixels and I/Os to be interconnected. ACFs composed of an adhesive polymer and fine conductive fillers such as metallic particles or metal-coated polymer balls are key materials for fine pitch chip-on-film(COF) and chip-on-glass(COG) LCD packaging technologies. Understanding the conduction mechanism of ACFs will impact on the better performance and reliability of LCD packages by choosing right ACF materials, proper processing conditions and ACF materials development in the future. To understand the efficiency of electrical conduction in ACF, the theoretical electrical conduction model with physical contact mechanism has been simulated and experimentally proved. The electrical resistance of ACF interconnection depends on the external pressure, mechanical and electrical properties of particles. Three pressure dependent models-1)elastic deformation Hertz contact model, 2)plastic deformation model and 3)FEM model-are developed, and experimentally verified using nickel powder and metal-coated polymer filled ACFs. Electrical contact resistance was measured on metallized flexible printed circuit / ITO glass joint using a four-point-probe method. Electrical conduction through the pressure engaged contact area between conductive particles and conductor substrate is the main conduction mechanism in ACF interconnection. Contact resistance of ACF is determined by the contact area change between particles and contact substrates. An increase of contact area between conductive particles and substrate is due to the plastic deformation of particles in ACFs. As bonding pressure increases, a sharp decrease of contact resistance followed by a constant resistance value are observed after reaching the critical pressure value which is the bonding pressure for good electrical conduction. In addition, environmental effects on contact resistance such as thermal aging, high temperature/humidity aging and temperature cycling was also investigated. Increasing contact resistance after harsh environmental tests is mainly due to the thermal stress effect, elastic stress effect and partially due to the oxide formation of metal oxide on the conductive particles or metal substrate.

서지기타정보

서지기타정보
청구기호 {MMS 97029
형태사항 iii, 110 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Myung-Jin Yim
지도교수의 한글표기 : 백경욱
지도교수의 영문표기 : Kyung-Wook Paik
학위논문 학위논문(석사) - 한국과학기술원 : 재료공학과,
서지주기 참고문헌 : p. 109-110
주제 LCD packaging
ACF
Contact resistance
Reliability
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