서지주요정보
Cu/Cr 박막과 폴리이미드의 접착에 관한 연구 = A study on the adhesion of Cu/Cr films deposited on polyimide
서명 / 저자 Cu/Cr 박막과 폴리이미드의 접착에 관한 연구 = A study on the adhesion of Cu/Cr films deposited on polyimide / 박익성.
저자명 박익성 ; Park, Ik-Seong
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007402

소장위치/청구기호

학술문화관(문화관) 보존서고

DMS 97010

휴대폰 전송

도서상태

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반납예정일

초록정보

In the microelectronics packaging, the adhesion strength between Cu and polyimide is very important factor that determines the device performance and reliability. However, the adhesion strength of Cu film to polyimide is inherently poor, so the Cr layer is used as an interlayer between Cu and polyimide to enhance the adhesion properties. To enhanced the adhesion properties, it is very important to understand the characteristics of adhesion test method because there are no way to measure the true adhesion strength. Peel adhesion test is the most popular adhesion test method, because it is simpler and easier than others. To enhance the adhesion, the polyimide surface is treated by Ar ion or others. In the case of Ar ion treatment, the electric resistance of polyimide surface is decreased and the leakage of current occurs through the layer and it induces the electrical failures in the MCM package. In this paper, at first, it was studied that the effects of adherend and pretreatment at various Ar+ rf plasma power densities on the peel adhesion strength. At second, the method to increase the adhesion without the plasma pretreatment was studied. In chapter 1, the microstructure, mechanical properties and the relation between strain and X-ray peak broadening of adherend Cu films are presented. It is necessary to know the effects of thickness and mechanical properties of adherend on the peel strength. As adherend thickness, the electroplated Cu thickness, increases, the grain size increases but the defects decrease. The yield strength of adherend is proportional to the $t^{-1/2}$, t means thickness, and it may be caused by the grain size and defects. X-ray peak broadening, ΔFWHM, is proportional to the plastic strain parabolically. In chapter 2, the effects of thickness, mechanical properties of adherend and pretreatment conditions on the peel strength were presented. As the Ar+ rf plasma power density is increased, the reactions between Cr and carbon in polyimide at the interface and plastic deformation of adherend are increased. The plastic work expenditure was estimated using K. S. Kim's theory, X-ray peak broadening of peeled adherend and the results in previous chapter. The results indicate that the plastic work expenditure is increased with Ar+ rf plasma power density and it behavior is similar to the peel strength. Also the peel strength is strongly affected by the film thickness and the pretreatment condition in a synergistic way, and that the peel strength shows a maximum at an intermediate thickness level. The estimated work expenditure was close to measured peel strength for most of the cases, which indicates that the measured peel strength is more a measure of the plastic deformation during the peel test than a measure of the true interfacial fracture energy. The peel strength is decreased as the ultimately tensile stress is increased, because it is hard to deform the adherend plastically. In chapter 3, the effects of heat treatment on peel strength are presented. The peel strength is increased as the heat treatment time and temperature are increased without regard to the pretreatment conditions. Also the failure locus is shifted to the interior to the polyimide by heat treatment.

서지기타정보

서지기타정보
청구기호 {DMS 97010
형태사항 xiii, 123 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Ik-Seong Park
지도교수의 한글표기 : 유진
지도교수의 영문표기 : Jin Yu
수록잡지명 : "Creep Cavitation a NiCr Steel, . A, Vol. 23A, 201, 1992". Metall. Trans, vol. 2A, 201 (1992)
수록잡지명 : "Reliability Measurements of Cu-Cr Alloy/Polyimide Films under $350\,^\circ\!C$ and $85\,^\circ\!C$/85\% R. H. Environments". J. Mat. Sci., vol. 7, 175 (1996)
학위논문 학위논문(박사) - 한국과학기술원 : 재료공학과,
서지주기 참고문헌 : p. 119-123
주제 접착
필 강도
구리
크롬
폴리이미드
Adhesion
Peel strength
Cu
Cr
Polyimide
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