서지주요정보
Optical parallel high-speed interconnection using an optial fiber ribbon = 광섬유 리본을 이용한 고속 병렬 광 상호연결
서명 / 저자 Optical parallel high-speed interconnection using an optial fiber ribbon = 광섬유 리본을 이용한 고속 병렬 광 상호연결 / Jong-Min Cheong.
저자명 Cheong, Jong-Min ; 정종민
발행사항 [대전 : 한국과학기술원, 1995].
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8005961

소장위치/청구기호

학술문화관(문화관) 보존서고

DEE 95041

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초록정보

Optical parallel interconnection system is essential for the high-speed data transmission in the asynchronous transfer mode (ATM) switching system which should handle tens of thousand channels of 156 Mbit/s wideband services for future broadband integrated services digital networks (B-ISDN). To overcome the limits of electrical interconnects in board-to-board level, this thesis propose the optical interconnects using an optical fiber ribbon. Effects of the receiver bandwidth increase on the performance of the optical parallel interconnection systems are described. The dominant effects are the skew, the optical power penalty due to the receiver bandwidth increase, the crosstalk between devices in a front-end array, the signal degradations due to the bandwidth limitation, and the margin. To maintain an appropriate eye margin and to get low optical power penalty within the increased skew range, the ratio between the crosstalk capacitance and the total input capacitance needs to be restricted for a given operating speed. The low crosstalk capacitance is very important in high speed optical parallel interconnections because the total input capacitance is small. When designing a practical fixed level decision (FLD) receiver circuits, it is possible to increase the allowable skew by increasing the receiver bandwidth. Using the calculated results and the optical power budget, we can design the FLD receiver circuit with an optimum transfer characteristic for large allowable skew. A large alignment-tolerant coupling scheme of the laser diode (LD) array into the single-mode fiber (SMF) array is proposed. A tapered waveguide array is used as an intermediate coupling device to improve the lateral misalignment tolerance up to 6 m. The theoretical and experimental results show that the proposed passive alignment scheme with the flip-chip solder-bump technique can provide a simple (low-cost) packaging method for the LD/SMF array modules. This coupling scheme will also find wide applications in the hybrid integration of optoelectronic devices that are flip-chip bonded on silicon substrate. A p-i-n photodiode (PD) array having the small crosstalk capacitance is fabricated for the high-speed optical receiver array. Then, we packaged the optical fiber/PD array modules, proposing a simple time-saving alignment method. External coupling efficiencies are about 95 % for both the SMF/PD array module and the MMF/PD array module. The fabricated four channel front-end array has 3-dB bandwidth of 1 GHz.

서지기타정보

서지기타정보
청구기호 {DEE 95041
형태사항 iv, 110 p. : 삽도 ; 26 cm
언어 영어
일반주기 저자명의 한글표기 : 정종민
지도교수의 영문표기 : Sang-Yung Shin
지도교수의 한글표기 : 신상영
학위논문 학위논문(박사) - 한국과학기술원 : 전기및전자공학과,
서지주기 Reference : p. 105-110
주제 Optical Interconnection
Photodetector Array
Silica Waveguide
Hybrid Integration
광 상호연결
광검출기 어레이
실리카 광도파로
하이브리드 집적
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