서지주요정보
Cu-epoxy 계의 접착력에 관한 연구 = A study on the adhesion of Cu-epoxy system
서명 / 저자 Cu-epoxy 계의 접착력에 관한 연구 = A study on the adhesion of Cu-epoxy system / 최광성.
저자명 최광성 ; Choi, Kwang-Seong
발행사항 [대전 : 한국과학기술원, 1995].
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소장정보

등록번호

8005766

소장위치/청구기호

학술문화관(문화관) 보존서고

MEM 95018

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초록정보

To enhance the adhesion of copper-based epoxy/metal interfaces, copper is oxidized, in 95℃, $NaClO_2$(37.5g/l), NaOH(50g/l), $Na_3PO_4 \cdot 12H_2O$(100g/l) solution to form black oxide composed of cuprous oxide and cupric oxide, or 70℃, $NaClO_2$(160g/l), NaOH(10g/l) solution to form brown oxide composed of cupric oxide and then laminated with prepreg which is glass cloth impregnated with a resin. In the case of black oxide coating, the peel strength decreases by the 30g/mm as oxidation time increases till 1min, then becomes constant. This behavior of peel strength is similar to that of thickness of cuprous oxide. The failure locus is cuprous oxide. Therefore, weak adhesion of this system is due to the existence of cuprous oxide. For brown oxide coating, the peel strength increases by the 76g/mm as oxidation time increases till 1min, then becomes constant. The oxide is in the form of long thin needle growing approximately perpendicular to the copper surface. Failure occurs transverse between cupric oxide and epoxy. Strong adhesion of this system is mainly due to mechanical interlocking between cupric oxide and epoxy. Reliability test reveals that the peel strength of black oxide coated copper/epoxy system is constant with aging time at 120℃. But, in the case of brown oxide coated copper/epoxy system, the peel strength decreases by the 82g/mm with aging time at 120℃, which is considered owing to the formation of cuprous oxide.

서지기타정보

서지기타정보
청구기호 {MEM 95018
형태사항 [v], 67 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Kwang-Seong Choi
지도교수의 한글표기 : 이원종
지도교수의 영문표기 : Won-Jong Lee
학위논문 학위논문(석사) - 한국과학기술원 : 전자재료공학과,
서지주기 참고문헌 : p. 63-67
주제 Epoxy compounds.
Adhesion.
Copper.
Fractures.
에폭시 수지. --과학기술용어시소러스
접착 강도. --과학기술용어시소러스
구리. --과학기술용어시소러스
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