We analyze the variations of thermal characteristics of laser diode arrays packaged by a flip-chip bonding method writing a computer program based on the boundary method. From the temperature distribution for laser diode arrays, we find that thermal crosstalks in laser diode arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in the conventional laser diode arrays. In the laser diode array module packaged by the flip-chip bonding technique without thermo-electric cooler, the important parameter is the absolute temperature increase of the active layer due to thermal crosstalk. Also we find that the temperature of the active layers of laser diode arrays increases up to 125℃ when all four laser diodes, without a carefully designed heatsink, are turned on with the indivisual laser diode power consumption of 100mW. In order to reduce thermal crosstalk, we propose a heatsink structure that may decrease the temperature at the active layer by 40%.
