Continuing miniaturization of electronic components results in increase in power density and temperature rise of the components. The cooling of these components thus becomes one of the major subjects in electronic packaging designs. The 3D laminar mixed convection flow between the PC(printed circuit) boards, on which the heat generating rectangular blocks are uniformly distributed, has been examined in the present study. Using an algorithm of SIMPLE type, the continuity equation, the Navier-Stokes equations, and the energy equation are solved numerically in the 3D domain inside the channel. The convective derivative terms are discretized by the QUICK scheme to accurately capture the flow field. The flow and the heat-transfer characteristics are thoroughly examined for various Re and Gr combinations and/or for the range of block size and distribution.
Compared with earlier study, the three dimensionality of the flow, the characteristics are thoroughly examined for various Re and Gr combinations and/or for the range of block size and distribution.
Compared with earlier study, the three dimensionality of the flow, the effects of the buoyancy force, and the conjugate heat transfer are scrutinized in the study
