서지주요정보
X선을 이용한 PCB 장착 상태 검사 알고리즘 개발 = Development of PCB inspection algorithm using X-ray
서명 / 저자 X선을 이용한 PCB 장착 상태 검사 알고리즘 개발 = Development of PCB inspection algorithm using X-ray / 오형렬.
저자명 오형렬 ; Oh, Hyeong-Ryeol
발행사항 [대전 : 한국과학기술원, 1994].
Online Access 제한공개(로그인 후 원문보기 가능)원문

소장정보

등록번호

8004550

소장위치/청구기호

학술문화관(문화관) 보존서고

MPE 94019

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

In this thesis, a new algorithm for PCB inspection using x-ray was developed. Using X-ray, inspection of not only visible but invisible defect is possible, because x-ray has transmission characteristics. Algorithm has three inspection steps. At the first step, solder state is determined by backpropagation neural network by classifying input patterns which is the slice areas with different heights of solder joint. Slice areas are extracted with high speed utilizing ILUT and histogram operation. At the second step, defects as bridge or solder ball are detected by counting the number of object regions in the window for bridge/solder ball inspection. This step utilizes quad tree segmentation to separate objects from background. At the last step, IC rotation is inspected by calculating the solpe of the regression line of solder points which are captured in a view field of the camera. The computer simulation using real x-ray image of the solder joints shows high noise immunity and high speed inspection which is not affected whether the leads are visible or not.

서지기타정보

서지기타정보
청구기호 {MPE 94019
형태사항 v, 66 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Hyeong-Ryeol Oh
지도교수의 한글표기 : 권대갑
지도교수의 영문표기 : Dae-Gab Gweon
학위논문 학위논문(석사) - 한국과학기술원 : 정밀공학과,
서지주기 참고문헌 : p. 32-34
주제 X-rays --Industrial applications.
Printed circuits.
Solder and soldering.
Nerual networks (Computer science)
결함 검사. --과학기술용어시소러스
비파괴 검사. --과학기술용어시소러스
기관. --과학기술용어시소러스
X선 검사. --과학기술용어시소러스
신경 회로망. --과학기술용어시소러스
QR CODE qr code