서지주요정보
에폭시수지의 경화 및 냉각시 발생하는 잔류응력에 관한 연구 = Residual stress during curing and cooling in an epoxy resin
서명 / 저자 에폭시수지의 경화 및 냉각시 발생하는 잔류응력에 관한 연구 = Residual stress during curing and cooling in an epoxy resin / 황재영.
저자명 황재영 ; Hwang, Jae-Young
발행사항 [대전 : 한국과학기술원, 1994].
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소장정보

등록번호

8004291

소장위치/청구기호

학술문화관(문화관) 보존서고

DCHE 94009

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

Residual stress in the cured epoxy resin is generated by non-uniform temperature profile during curing and cooling process and influences the mechanical strength, dimensional stability and other properties of the epoxy molded article. Two kinds of epoxy resin were used in this study. One is the diglycidyl epoxy system, consisting of EPON 9405 epoxy resin(diglycidyl ether of bisphenol A type) and EPON 9470 curing agent and the other is the tetraglycidyl epoxy system, consisting of MY-720 epoxy resin(tetraglycidyl 4,4' diaminodiphenyl methane, TGDDM type) and diaminodiphenyl sulfone(DDS) curing agent. Residual stress distribution of the epoxy plate was measured by the layer removal method and calculated by the computer simulation using physical properties measured and basic equations describing the reaction kinetics, thermal conductivity, density and relaxation modulus change during the process. Residual stress generated during the cure of the difunctional epoxy system is negligible since the curing temperature is always higher than the glass transition temperature. But during the cooling process, thermal stress is developed owing to the differences in volume contraction across the thickness direction. During the rapid cooling process, residual stress distribution in the epoxy plate calculated by the linear thermoviscoelastic theory considering specific volume relaxation agreed well with the results measured by the layer removal method. When the starting temperature of the cooling process was near the glass transition temperature of the cured epoxy, residual stress in the epoxy plate was smaller than when the starting temperature was higher than the glass transition temperature. However, the transient stress in the cured epoxy plate was higher when the starting temperature was near the glass transition temperature than when the starting temperature was higher than the glass transition temperature. The quenched epoxy plate was compressed in the parallel direction at the surface and extended at the center. During the cure of the tetrafunctional epoxy system, the residual stress was generated due to the vitrification effect. Residual stress distribution obtained from computer simulation for the cure process was similar to the result measured by the layer removal method.

서지기타정보

서지기타정보
청구기호 {DCHE 94009
형태사항 xiv, 120 p. : 삽도 ; 26 cm
언어 한국어
일반주기 부록 수록
저자명의 영문표기 : Jae-Young Hwang
지도교수의 한글표기 : 김성철
지도교수의 영문표기 : Sung-Chul Kim
학위논문 학위논문(박사) - 한국과학기술원 : 화학공학과,
서지주기 참고문헌 : p. 93-96
주제 Curing.
Residual stresses.
에폭시 수지. --과학기술용어시소러스
경화. --과학기술용어시소러스
잔류 응력. --과학기술용어시소러스
Epoxy resins.
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