This paper considers the conjugate analysis of mixed convection heat transfer to minimize the maximum temperature at the chip arising from the uniform heat flux sources mounted on a conducting plate. The primary motivation for this work is to delineate the physical importance of the thermal periodicity between Printed-Circuit-Boards consisting of repeated layers on the flow field and heat transfer characteristics. Finite-difference numerical solutions have been obtained for air and water over a range of Reynolds numbers (100 ≤ Re ≤ 1500) and Grashof numbers ($0 ≤ Gr ≤ 5 × 10^5$) : this leads the mixed convection parameter, defined by $Gr/Re^2$, to be varied over a broad range, covering both the pure forced convection, the natural convection dominated regimes, and the mixed convection regime in-between. The heat transfer characteristics are presented for two cases, that of a horizontal plate and the vertical plate.
For a smaller Pellet number, the thermal boundary layers from the two plates in the channel mix and the plate is an adiabatic wall which has nearly constant wall temperature only in further downstream region from the last block therefore, the adiabatic wall assumption cannot be employed to simulate a practical cooling modules, which consists of multiple-layered boards.
본 논문에서는 Computer의 발달과 더불어 심화되고 있는 Chip 내부의 열적 문제점에 대한 열전달 특성을 파악하기위하여 전도가 존재하는 다층기판의 혼합대류를 고려하였다. 기존의 단열 기판에 대한 수치해를 확장하여 여러 층을 이루는 기판들 사이에 주기적 경계조건을 사용하므로써 기판 사이의 실제적인 유동과 온도장이 파악되었다.
다층기판의 경우 Chip으로부터 상당히 후류에서만 단열, 등온가정이 만족되었고 이는 기존의 연구가 Chip이 밀집되어있고 여러 층을 이루는 다층기판에는 적용이 어려움을 나타낸다.
