서지주요정보
웨이퍼 가공기의 진동 해석 및 실험적 검증 = Vibration analysis of wafer cutting machine and its experimental verification
서명 / 저자 웨이퍼 가공기의 진동 해석 및 실험적 검증 = Vibration analysis of wafer cutting machine and its experimental verification / 김명업.
발행사항 [대전 : 한국과학기술원, 1990].
Online Access 제한공개(로그인 후 원문보기 가능)원문

소장정보

등록번호

8000661

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 9007

휴대폰 전송

도서상태

이용가능(대출불가)

사유안내

반납예정일

리뷰정보

초록정보

The vibrations of the outer-clamped rotating disk which simulates a wafer cutting machine are investigated. The effects of the centrifugal force and the outer-fixture extension caused by rotation and radial tension to study the vibration characteristics of the outer clamped rotating disk are considered. And mode shapes of the outer-clamped stationary disk subjected to uniform and partially non-uniform radial tension are studied. The modal parameters of the disk are obtained employing Galerkin's method. The increase of the spin speed decreases the natural frequencies of disk which is clamped by ideally rigid fixture. But the flexibility of fixture should be taken into account because the fixture extension caused by rotation increases the natural frequencies. The stress distributions of the rotating disk with the extensible outer-fixture are formulated and the stress formulations well represent this phenomenon. Experiments for a rotating disk and a stationary disk in case of uniform and non-uniform tension are also performed and it is found that the experiment and simulation results are in good agreement.

서지기타정보

서지기타정보
청구기호 {MME 9007
형태사항 v, 66 p. : 삽화 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Myeong-Eob Kim
지도교수의 한글표기 : 이종원
지도교수의 영문표기 : Chong-Won Lee
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학과,
서지주기 참고문헌 : p. 29-30
주제 Semiconductor wafers.
Rotors --Dynamics.
Cutting machines --Vibration.
Galerkin methods.
Galerkin법. --과학기술용어시소러스
웨이퍼 (IC) --과학기술용어시소러스
진동 해석. --과학기술용어시소러스
기계 진동. --과학기술용어시소러스
축 진동. --과학기술용어시소러스
Vibration --Research.
QR CODE

책소개

전체보기

목차

전체보기

이 주제의 인기대출도서