This study is undertaken to examine the correlation of the amounts of alumina with both the mechanical properties and electrical conductivities of the oxide dispersed copper alloys by means of the scanning electron and optical microscopy.
Also the behaviors of recrystallization temperature in relation to the amounts of alumina particles was investigated.
The evidence has shown that tensile strength of the alloy is inversely proportional to the spacing of the alumina stringer exponentially.
The presence of the proper amount of alumina particles has strongly influenced on behavior of the recrystallization temperature, i.e., the alloy of 3 volume percent alumina has increased the recrystallization temperature up to 700℃ in comparison with the 250℃ for pure copper, whereas electrical conductivity of the alloy has somewhat decreased.
With observation made in this study, it leads a conclusion that the sintered alloy contaning several percent of the alumina has exhibited both good mechanical properties and electrical conductivities suitable for the heat resistant of electrical materials.
