The phenomenon of strain burst is observed in Cu-25Ni alloy subjected to cyclic creep at intermediate temperature (0.45-0.55Tm) and high stress, however in static creep under the same condition, strain burst is never occurred.
The purpose of this work is to study the tendency and mechanism of strain burst.
Strain bursts occur frequently as the temperature and stress are increased, but at low stress or high temperature strain burst is not observed.
To understand the cause of strain burst, several transient creep tests are performed.
As the result of experiments, strain bursts can be seemingly explained by instantaneous large increase in mobile dislocation densities caused by destruction of cell boundaries on reloading which is due to localized dislocation network spacing growth by recovery during cyclic unloading.
