Cu-O Eutectic melt 에 의한 alumina 소결체와 전해동의 접합 = Alumina ceramic-to-copper bonding by Cu-Oeutectic melt

• 서명 / 저자: Cu-O Eutectic melt 에 의한 alumina 소결체와 전해동의 접합 = Alumina ceramic-to-copper bonding by Cu-Oeutectic melt / 김도경.
• 발행사항: [서울 : 한국과학기술원, 1984].

This study is concerned with direct bonding of copper-alumina ceramics employing copper-oxygen eutectic melt. Electrolytic copper was bonded to the alumina ceramics at the temperature between melting temperature of pure copper and copper-oxygen eutectic temperature in commercial high purity nitrogen gas.
Bonding mechanism and the effects of apparent density and surface roughness of alumina ceramics on the bond strength were investigated.
The result indicated that the copper bonded to the alumina ceramics by means of Cu$_2$O nodules which were formed from Cu-O eutectic melt. Stronger bond strength was observed in the ceramic of higher apparent density and smoother surface.

• 형태사항: iii, 34 p. : 삽화 ; 26 cm
• 언어: 한국어
• 일반주기: 저자명의 영문표기 : Do-Kyeong Kim ; 지도교수의 한글표기 : 김종희 ; 지도교수의 영문표기 : Chong-Hee Kim
• 학위논문: 학위논문(석사) - 한국과학기술원 : 재료공학과,
• 서지주기: 참고문헌 : p. 33-34
• 주제: Sintering. ; Ceramics. ; Surface roughness. ; Density. ; 소결체. --과학기술용어시소러스 ; 용융 금속. --과학기술용어시소러스 ; 세라믹. --과학기술용어시소러스 ; 접합 강도. --과학기술용어시소러스