This thesis is to find out the optimal design of spool and bar horn to achieve uniformity more than 95%. The DOE(Design Of Experiment) technique was applied with the help of Minitab to find the optimal value of various feature dimensions. To find the axial mode of vibration and natural frequency of both type of horns, modal and harmonic analysis were carried out with the help of ANSYS software. The uniformity evaluated by analysis was more than 95% for each case.
The experimental validation was carried out by LDV(Laser Doppler Vibrometer) to find displacement and frequency for each types of horn. Experiments show that the calculated displacements of the horns are in good agreement with the measured results. The designed one slot bar horn was further employed to bond Sn-Sn bumps and Cu-Sn bumps which has vast application in electronic packaging. The solid-state bond between Strip-type Cu and Sn bumps aligned at right angle was successfully achieved through the application of ultrasonic energy.
이 논문에서는 95%의 진폭균일도를 만족하는 스풀 혼과 바 혼의 최적 조건을 제시하였다. MINITAB을 이용한 실험계획법을 이용해 최적 조건을 찾았고, 축방향 진동모드와 공진주파수를 찾기 위해 ANSYS를 이용하여 모드해석과 하모닉해석을 수행하였다. 설계된 바 혼과 스풀 혼의 진폭균일도는 95% 를 만족하였고, LDV로 바 혼의 진폭을 측정하여 설계의 타당성을 검증하였다. 1 슬롯 바 혼을 전자패키징에 적용하기 위해 Sn-Sn 범프와 Cu-Sn범프를 교차시켜 고상 접합 실험을 수행하였다.