Wireless communications technology has been going through rapid development at a pace which is unprecedented in the technological age. This is because several technologies, integrated circuits (IC) and packaging have reached sufficient maturity within the last five years. There are potentially limitless applications related to wireless communication frequency bands. The emergence of wireless communications and the startling growth of corresponding high-frequency usage, into the millimeter wave regime, have brought new demands for increased performance with simultaneous decreases in size for both ICs, packaging and interconnect technologies. Since the performance of analog ICs is inversely proportional to frequency for a fixed area, more circuitry is required at high frequency to maintain the functionality. As a result, the size of a conventional package is larger to accommodate the increasing circuitry. One method to to retain performance and size is to utilize the vertical dimensions in conventional packages and modules. Multi-layer interconnects in a 3-D packaging architecture at microwave become crucial for the design and development of a single package.
This thesis work focuses on the 3-D implementation using organic film, and microwave application. Especially layer-to-layer interconnection method through metal is introduced for the first time.
무선통신 기술은 최근들어 빠르게 성장하고 있다. 이에 대한 몇가지 요인으로는 집적기술과 패키지 기술이 향상을 들 수 있겠다. 무선 통신의 발달과 고주파에 대역에 대한 필요성으로 인해 현재 존재하는 기판 기술 또한 변화가 요구 된다. 본문에서 제시한 유기 필름은 수십 마이크로 미터의 두께를 가지며, 고주파 응용시 손실이 낮다는 점에서 유리한 재질이다. 본 논문은 유기필름을 이용해 적층화 구조를 제시하였고, 실험을 통해 전기적 연결상태를 확인하였다
