Embedded capacitor technology is one of the effective packaging technologies for miniaturization and high performance of electronic package systems. High dielectric constant ceramic-epoxy composites have been of great interest as embedded capacitor material candidates, because they have good process compatibility with multilayer organic substrates applications such as printed wiring boards (PWB).
In previous studies, $epoxy/BaTiO_3$ composites embedded capacitor films had been newly developed. In this work, it was established curing kinetics model by nth-order curing kinetics for newly developed materials. So it was possible to predict the curing conditions of these materials.
When cured embedded capacitor films had been exposed on ambient of higher temperature than $T_g$ (glass transition temperature), it was observed that capacitance was relaxed. It had relation to free volume expansion of epoxy matrix by relaxation of residual stress, caused by curing.
It was studied temperature dependency of embedded capacitor films. The temperature dependence of capacitance on epoxy, one of the important materials consisted embedded capacitor films, was related with molecular flexibility. The temperature dependence of dielectric constant on $BaTiO_3$ powder had similar tendency in the case of bulk $BaTiO_3$. The temperature dependence of capacitance on embedded capacitor films was mainly affected by properties of epoxy.
