Nowadays, Large area production techniques in micro-electronic industry become wide-spread rapidly. Specially, flat display processing has been entered 5th generation, $1×1.2mm^2$ processing techniques. As a result, large area deposition equipment need to be developed. Planar magnetron sputtering system is generally used for large area deposition. The target erosion usually occurs locally so that its life time is below 500kWh for 10mm thickness treat. To reduce processing cost uniform erosion of target has to be need. In other words, as possible as large area target in magnetron sputtering system must be eroded uniformly. B-field from magnetron source in magnetron sputtering system traps electrons locally area on target surface. It causes local target erosion so reduces target life time.
Magnet assembly of magnetron sputtering system determines B-field gradient and strength so predicting B-field is need. Plasma simulation predicts target erosion shape by establishing ion current distribution on target surface. And B-field simulation on target surface in magnetron sputtering system accomplished by Superfish program which is made for magnetic field simulation.
