서지주요정보
나노 압입자를 이용한 박막/모재 구조의 계면파괴인성치 평가 = Evaluation of interfacial toughness of film/substrate by nanoindenter
서명 / 저자 나노 압입자를 이용한 박막/모재 구조의 계면파괴인성치 평가 = Evaluation of interfacial toughness of film/substrate by nanoindenter / 서병국.
저자명 서병국 ; Suh, Byung-Guk
발행사항 [대전 : 한국과학기술원, 2004].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014935

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 04037

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초록정보

A method to measure the interfacial toughness of film/substrate by nanoindenter is proposed as the thickness of the film decreases, the measurement of the interfacial toughness requires the more sophisticated technique such as nanoindentation. In this study, the nanoindenter is applied to the substrate very near the interface of film/substrate in the direction perpendicular to the normal of the interface, causing the cohesive fracture of the substrate, followed by the interfacial cracking. The length of the interfacial crack is measured, using the relation between the crack length and the displacement jump during the nanoindentation. The specimen of Cu(0.56 μm)/Si(530 μm) are made by sputtering the copper onto the silicon wafer. By scratching the copper surface, we can make the easy interfacial cracking during the nanoindentation. It is found that the averaged values of the interfacial toughness of the Cu/Si is 0.664±0.3 J/㎡. The phase angle of the specimen in this study is $ψ\simeq-36.8˚$, computed by a method of Suo and Hutchinson(1990).

서지기타정보

서지기타정보
청구기호 {MME 04037
형태사항 v, 39 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Byung-Guk Suh
지도교수의 한글표기 : 엄윤용
지도교수의 영문표기 : Youn-Young Earmme
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 38-39
주제 계면파괴인성치
계면박리
나노 압입자
단면압입시험
박막
interfacial toughness
interfacial delamination
nanoindenter
cross-sectional nanoindentation
thin film
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