서지주요정보
스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구 = A study on ultrasonic bonding with strip-type au bumps
서명 / 저자 스트립 형상의 Au 범프를 이용한 초음파 접합에 관한 연구 = A study on ultrasonic bonding with strip-type au bumps / 김병철.
저자명 김병철 ; Kim, Byung-Chul
발행사항 [대전 : 한국과학기술원, 2004].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014907

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 04009

휴대폰 전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The longitudinal ultrasonic vibration is used to bond the Au bumps for electronic packaging. Strip-type Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. To expect deformed shape of bump in micro-scale gold bump, F.E.M analysis and compression test of macro-scale aluminum bump is conducted. From analysis and experiment the shape of deformed stripe type Al bump is saddle configuration. This result is confirmed by measurement of deformed shape of gold bump using nano-scale 3D-profiler. As the configuration of the bump becomes similar to that of the saddle by plastic deformation, it provides larger contact surface. Deformed configuration also promotes solid-state bonding because the friction force is imposed on the contact surface similar to the wire bonding. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained due to larger contact surface and friction force.

서지기타정보

서지기타정보
청구기호 {MME 04009
형태사항 vi, 64 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Byung-Chul Kim
지도교수의 한글표기 : 유중돈
지도교수의 영문표기 : Choong-Don Yoo
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 27-29
주제 종방향 초음파
Au 범프
스트립 범프
고상접합
전자패키징
Longitudinal ultrasonic
Au bumps
Crossed strip-type bumps
Solid-state bond
Electronic packaging
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