서지주요정보
하이브리드형 적외선 감지 소자를 위한 범프 연구 = Bump formation for hybrid infrared focal plane array
서명 / 저자 하이브리드형 적외선 감지 소자를 위한 범프 연구 = Bump formation for hybrid infrared focal plane array / 이경호.
저자명 이경호 ; Lee, Kyung-Ho
발행사항 [대전 : 한국과학기술원, 2003].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014611

소장위치/청구기호

학술문화관(문화관) 보존서고

MEE 03113

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

Flip-chip bonding technique using indium bump for hybrid IRFPA(Infrared Focal Plane Array) is studied. The mismatch in the coefficients of thermal expansion between HgCdTe and silicon is related to flip-chip bonding reliability. To improve flip-chip bonding reliability, strong adhesion between indium bump and contact pad is required. Increasing bonding temperature over melting point of indium(156℃) is easy way to achieve strong adhesion between indium bump and contact pad, but HgCdTe wafer would be damaged. To minimize the damage of HgCdTe wafer and to maximize adhesion, contact pad is changed to indium-bismuth alloy which has low melting point(71℃) and adhesive to indium. Increasing bonding temperature affected good adhesion between indium bump and indium-bismuth pad but still has leveling problem related to flip-chip bonder. To avoid this problem, post bonding reflow is necessary. It is shown that post bonding reflow around 120℃ has an effect on bonding reliability, both electrical and mechanical property.

서지기타정보

서지기타정보
청구기호 {MEE 03113
형태사항 iv, 41 p. : 삽도 : 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Kyung-Ho Lee
지도교수의 한글표기 : 이희철
지도교수의 영문표기 : Hee-Chul Lee
학위논문 학위논문(석사) - 한국과학기술원 : 전기및전자공학전공,
서지주기 참고문헌 : p. 40-41
주제 범프
하이브리드칩
합금
인듐
비스무스
bump
hybrid chip
alloy
indium
bismuth
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