서지주요정보
레이저를 이용한 실리콘의 공정 접합 방법 = Eutectic bonding method of silicon using laser
서명 / 저자 레이저를 이용한 실리콘의 공정 접합 방법 = Eutectic bonding method of silicon using laser / 정상엽.
저자명 정상엽 ; Jung, Sang-Youp
발행사항 [대전 : 한국과학기술원, 2003].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8013903

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 03061

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

Since laser has high power density, it is useful in MEMS packaging application such as silicon-glass bonding and silicon-silicon bonding. Irradiating laser on Si-Au-Si layer, Si layers bond by Au-Si eutectic bonding around 400℃. Shape of upper silicon, absorption coefficient and reflectivity determines power absorption. Suggest reflection-absorption method and transmission method to get fast bonding and localized heating effect with various upper silicon shape using Nd:YAG laser and $CO_2$ laser. As to power absorption transmission method using Nd:YAG laser is good and control power absorption by upper silicon groove depth. For localized heating transmission method using Nd:YAG laser with large depth of upper silicon groove is more effective rather than reflection-absorption method. As absorption coefficient of Nd:YAG laser is larger than $CO_2$ laser, silicon absorbs Nd:YAG laser power more and absorbed power density of silicon surface is higher than other parts of silicon. High absorbed power density of upper silicon surface and groove thickness with Nd:YAG laser affect Si-Au-Si bonding with localized heating. Irradiating laser as a spot has the limited effect on localized heating but increasing laser power with changing laser spot to line has the possibility of local heating.

서지기타정보

서지기타정보
청구기호 {MME 03061
형태사항 vi, 56 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Sang-Youp Jung
지도교수의 한글표기 : 유중돈
지도교수의 영문표기 : Choong-Don Yoo
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 22-23
주제 접합
레이저
실리콘
공정
패키징
bonding
laser
silicon
eutectic
packaging
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