Scanning electron microscopy (SEM) has been used as a surface measurement instrument and a tool for lithography in semiconductor process due to its high density localized beam which makes possible semiconductor structures with sub-micrometer line width. But SEM has not been applied to the area of material process because its power is not enough for that purpose. Considering the conditions provided by SEM such as vacuum condition and on-line process monitoring system, the advantages that can be expected if material processing become possible is great.
So in this paper by modifying SEM to increase the amount of current reaching a specimen from gun part where current is generated, the possibility of applying SEM to material processing, especially microjoining, is investigated. The maximum current of SEM after modifications was measured up to 10㎂, which is $10^5$ times greater than before modifications.
Through experiments such as eutectic solder wetting on thin stainless steel 304 foil and microjoining of 10um thick stainless steel 304, the intensity of electron beam of SEM proved to be great enough for material processing as heat source. And a tight jig system was found necessary to hold materials close enough for successful microjoining.
And by investigating the reactions occurring when electrons with high speed collide with solid material, a reasonable heat source modeling of SEM electron beam was suggested as heat generation within material.