서지주요정보
복합솔더 제조 및 리플로우 솔더링 특성 = The manufacture of composite solder and its reflow soldering characteristics
서명 / 저자 복합솔더 제조 및 리플로우 솔더링 특성 = The manufacture of composite solder and its reflow soldering characteristics / 황성용.
발행사항 [대전 : 한국과학기술원, 2002].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8012930

소장위치/청구기호

학술문화관(문화관) 보존서고

MMS 02039

휴대폰 전송

도서상태

이용가능

대출가능

반납예정일

리뷰정보

초록정보

Eutectic Pb-Sn solder has been widely used as a soldering material between electronic components and PCB(Printed Circuit Boards). Eutectic Sn-Ag solder is substituting Pb-Sn for the reason that it isn’t harmful to the human body and is suitable for higher temperature applications and has better mechanical properties. In spite of good mechanical properties of eutectic Sn-Ag alloy, another alternatives with better reliability are required for solder joints that can withstand much higher service temperature and thermomechanical fatigue due to CTE(Coefficient of Thermal Expansion) mismatch between components and substrates. One approach to improve the reliability is composite solder which consists of solder matrix and intermetallic reinforcements. Sn-6.9Cu-2.9Ag alloy has a primary $Cu_6Sn_5$ intermetallic compound in the form of dendrite in cast strips. After rolling the strips, the intermetallics were crushed from dendrites into fine particles and redistributed uniformly in the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached the critical size which wouldn’t be changed any more. The critical size was nearly the same as the average width of intermetallic dendrite trunks. To apply composite solder to the real BGA package, the stamped segments of rolled strip reinforced with intermetallic particles were converted into spherical solder balls in hot oil and subsequently reflowed on Cu pads. The crushed intermeallic particles didn’t melt and remained in solid sate during reflow soldering process due to their high melting temperature. The particle coarsening and gravitational segregation were observed during reflow soldering. In wetting reaction, Cu_6Sn_5 intermetallic compound(IMC) between composite solder and Cu pad was formed in scallop-type morphology, while the IMC between Sn-3.5Ag and Cu pad was formed in column-type morphology. After aging the two reflowed solder balls, the IMC thickness of composite solder is much smaller than that of Sn-3.5Ag. It was found that the presence of intermetallic particles retarded the growth of IMC layer during aging.

서지기타정보

서지기타정보
청구기호 {MMS 02039
형태사항 ii, 80 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Seong-Yong Hwang
지도교수의 한글표기 : 이진형
지도교수의 영문표기 : Zin-Hyoung Lee
학위논문 학위논문(석사) - 한국과학기술원 : 재료공학과,
서지주기 참고문헌 수록
주제 복합
솔더
리플로우
Cu6Sn5
금속간화합물
composite
solder
reflow
Cu6Sn5
intermetallic
QR CODE qr code