서지주요정보
Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cycling
서명 / 저자 Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 = A study on the thermal deformations of wafer-level CSP assembly under power cycling / 조만석.
저자명 조만석 ; Cho, Man-Seok
발행사항 [대전 : 한국과학기술원, 2001].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8011699

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 01054

휴대폰 전송

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이용가능

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초록정보

In this research, thermal deformations of CSP assemblies under power cycling were investigated using high sensitivity moirö interferometry and finite element analysis and the results under power cycling were compared with those under chamber cycling which is obtained from the same techniques. To observe the thermal deformations during chamber cycling, a moirö test was performed for the isothermal loading condition from 125℃ to 25℃. In the case of power cycling, the actual operating condition was simulated using a thermal chip in the package and the real-time moirö interferometry technique was used to measure the steady-state thermal deformation. The results show that the assembly bends in the opposite direction in power cycling as compared to its bending under chamber cycling. In addition, the test results obtained from the moirö interferometry technique were compared with the predicted values obtained from the finite element analysis. It is shown that the deformation values predicted from the finite element analysis have a good agreement with those obtained from the test. The FEM results show that the shear deformations of solder joints are almost same but the normal deformations are fundamentally different between the chamber cycling and the power cycling.

서지기타정보

서지기타정보
청구기호 {MME 01054
형태사항 v, 71 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Man-Seok Cho
지도교수의 한글표기 : 이순복
지도교수의 영문표기 : Soon-Bok Lee
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 34-37
주제 파워 사이클
웨이퍼 레벨
열변형
전자 패키지
모아레
power cycling
wafer-level
CSP
chip scale
thermal deformation
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