서지주요정보
랜덤진동상황에서의 표면실장부품 소더범프에 대한 피로수명평가 = Fatigue life assessment of bump type solder joint under random vibration environment
서명 / 저자 랜덤진동상황에서의 표면실장부품 소더범프에 대한 피로수명평가 = Fatigue life assessment of bump type solder joint under random vibration environment / 김태헌.
저자명 김태헌 ; Kim, Tae-Heon
발행사항 [대전 : 한국과학기술원, 1998.
Online Access 원문보기 원문인쇄

소장정보

등록번호

8008578

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 98026

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

One of the major engineering interest in second level packaging of electric system is the failure by a thermally induced stress. However, the electronic system often experiences the vibration in use, and therefor to assure the high product reliability, it is necessary to estimate the fatigue life in the random vibration environment. For this purpose, High cycle fatigue tests are performed under a constant amplitude loading and a random loading for the solder bump. The test machine utilizes the electromagnetic force as an actuator, and personal computer was used for force signal generation and data acquisition. The specimen used in this experiment is a BGA-type solder-printed circuit board (PCB). To introduce the stress in the solder bump, The PCB is subjected to a torsion with a 40 Hz frequency. The fatigue life is determined by a change of an electrical resistance in the solder bump. Using ABAQUS, the stress and total equivalent strain in the solder bump was calculated to determine the coefficients of the coffin-manson type fatigue life. The random force signal was calculated from a computer simulation with power spectrum and fatigue life of solder bump under random vibration is estimated by the rainflow cycle counting and linear damage rule.

서지기타정보

서지기타정보
청구기호 {MME 98026
형태사항 vi, 66 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Tae-Heon Kim
지도교수의 한글표기 : 이순복
공동교수의 한글표기 : 엄윤용
지도교수의 영문표기 : Soon-Bok Lee
공동교수의 영문표기 : Youn-Young Earmme
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학과,
서지주기 참고문헌 수록
주제 피로 수명
소더 범프
랜덤 진동
Fatigue life
Solder bump
Random vibration
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