서지주요정보
표면실장부품의 신뢰성확보를 위한 3차원 납 접합부의 형상결정 = Design criteria of 3D solder joint configuration for reliability of surface mount components
서명 / 저자 표면실장부품의 신뢰성확보를 위한 3차원 납 접합부의 형상결정 = Design criteria of 3D solder joint configuration for reliability of surface mount components / 주재갑.
저자명 주재갑 ; Joo, Jae-Kap
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007667

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 97087

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The motivation of this study is that the effect of solder joint shape and volume on the fatigue life is directly related to the quality of the soldering process. The solder profiles were calculated at given stand-off heights and solder volume. The calculated solder profile with Surface Evolver was compared with experimental results. Using ABAQUS, deformation and plastic strain distributions of four different cases were calculated. The specimen used in the experiments is BGA-type solder-printed circuit board(PCB). The solder joints specimen were made by conventional surface mount technology(SMT). BGA-type solder/PCB joints have been tested isothermally, in shear under total displacement-controlled tests, at 25℃. Isothermal low cycle fatigue of 63Sn/37Pb solder is studied. The joints were subjected to fully reversed ramp cycling with fixed displacement limits. The fatigue life was defined by a 10 and 25-percent load drop under a given displacement cycle. The plastic strain range was favored to be the governing parameter in fatigue life of near-eutectic BGA solder joint. Through experiments and finite element analysis results the optimal solder joint shape can be determined for the reliability of Surface Mount Components.

서지기타정보

서지기타정보
청구기호 {MME 97087
형태사항 v, 64 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Jae-Kap Joo
지도교수의 한글표기 : 이순복
지도교수의 영문표기 : Soon-Bok Lee
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학과,
서지주기 참고문헌 : p. 23-24
주제 Surface Evolver
소더 범프
신뢰성
Surface evolver
Solder bump
Reliability
QR CODE qr code