서지주요정보
하이브리드 적외선 감지 소자를 위한 인듐 범프의 연구 = The study of indium bump for hybrid infrared focal plane array
서명 / 저자 하이브리드 적외선 감지 소자를 위한 인듐 범프의 연구 = The study of indium bump for hybrid infrared focal plane array / 최종화.
저자명 최종화 ; Choi, Jong-Hwa
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007798

소장위치/청구기호

학술문화관(문화관) 보존서고

MEE 97087

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

Flip-chip bonding technique using indium bump for hybrid IRFPA(Infrared Focal Plane Array) is studied. The level of flatness of two chips that will be bonded is related to flip-chip bonding yield, and the mismatch in the coefficients of thermal expansion between HgCdTe and silicon is related to flip-chip bonding reliability. To improve flip-chip bonding yield and reliability, it is found that the indium bump should be high over 20um. The three methods of bump formation, lift-off, etch-back, and shadow mask method are studied and found not to be adequate to form high indium bumps. However, using the ICP $H_2$ plasma, indium bumps made by lift-off can be reflowed to hemispheres and the height of bump is increased from 10um to over 20um. In addition, the surface morphology of them is improved after the reflow. The structure of UBM(Under Base Metal) is studied. Indium bumps can be aligned precisely into base pad metal. The characteristics of reflowed bump is examined. It is shown that the reflowed bump is more stronger than the bump made by lift-off against shear strain. The proposed method of $H_2$ plasma reflow of indium bump is expected to enhance the flip-chip bonding yield and reliability of IRFPA's.

서지기타정보

서지기타정보
청구기호 {MEE 97087
형태사항 ii, 56 p. : 삽도 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Jong-Hwa Choi
지도교수의 한글표기 : 이희철
지도교수의 영문표기 : Hee-Cheul Lee
학위논문 학위논문(석사) - 한국과학기술원 : 전기및전자공학과,
서지주기 참고문헌 : p. 55-56
주제 인듐 범프
하이브리드 적외선 감지 소자
플립 칩 본딩
Indium bump
Hybrid infrared focal plane array
Flip-chip bonding
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