서지주요정보
페놀 수지의 경화 속도론 및 기계적 물성에 대한 연구 = Curing kinetics and mechanical properties of phenolic resin
서명 / 저자 페놀 수지의 경화 속도론 및 기계적 물성에 대한 연구 = Curing kinetics and mechanical properties of phenolic resin / 최민호.
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007530

소장위치/청구기호

학술문화관(문화관) 보존서고

MCHE 97032

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초록정보

Curing kinetics and mechanical properties of resol type of phenolic resin were studied for various isocuring temperatures and times. From the data of conversion and isocuring time, reaction rate constants at each isocuring temperature were determined and increased with temperature. Byproducts such as water was rapidly produced during the curing reaction at 210℃. From Arrhenius-type ananlysis, the activation energy and frequency factor for the curing were determined as 25.8kcal/mol and $4.44×10^{11}min^{-1}$. As a result, the conversion increased with the increase in isocuring time and temperature, and thus the crosslink density also increased. By the results of mechanical test, tensile strength, tensile modulus and toughness increased at 150~180℃. In the relationship between crosslink density and mechanical properties, a master curve could be obtained between 150℃ and 180℃, but not 210℃ at which the water vapor was generated very rapidly. It was thought that the mechanical properties of specimens made at 210℃ went down and started to deviate from the master curve because of the effect of water. From the scanning electron microscope experiment, it was found that the water rapidly produced in the curing reaction at high isocuring temperature much influenced the mechanical properties of resol type of phenolic resin. At 210℃ the material had the higher modulus than at 150~180℃ but lower tensile strength and toughness. Consequently, it is suggested to process according to the cascade-type curing procedure at 150 and 180℃.

서지기타정보

서지기타정보
청구기호 {MCHE 97032
형태사항 vi, 50 p. : 삽화 ; 26 cm
언어 한국어
일반주기 저자명의 영문표기 : Min-Ho Choi
지도교수의 한글표기 : 정인재
지도교수의 영문표기 : In-Jae Chung
학위논문 학위논문(석사) - 한국과학기술원 : 화학공학과,
서지주기 참고문헌 : p. 49-50
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