서지주요정보
인쇄회로기판의 통전검사용 이동촉침의 충격모델에 관한 기초연구 = A fundamental study on impact modelling of a flying probe for in-circuit testing of PCBs
서명 / 저자 인쇄회로기판의 통전검사용 이동촉침의 충격모델에 관한 기초연구 = A fundamental study on impact modelling of a flying probe for in-circuit testing of PCBs / 조익훈.
저자명 조익훈 ; Cho, Ick-Hoon
발행사항 [대전 : 한국과학기술원, 1996].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007028

소장위치/청구기호

학술문화관(문화관) 보존서고

MADE 96026

SMS전송

도서상태

이용가능

대출가능

반납예정일

초록정보

The In-Circuit test is to probe the integrity of the conductivity of the soldering on a PCB at high speed. It has been a very important process in quality controls that checks the correctness of positioning assembled electrical parts such as resistors, capacitors, and ICs, and detects faults of soldering. For the enhancement of the inspection efficiency, The probing devices currently used in industry contact with the solder joint at high speed (0.2~0.4 m/sec). As a consequence, the excessive contact force causes plastic deformation on the surface of a solder joint. The deformed surface is easily corroded by its oxidation. The corroded solder is likely to crack under a small shock. In order to obtain the appropriate inspection speed, and preserve the penetration depth within the limits, the impact model of the rigid probe and the solder joint is needed. In this paper, considering the variant penetration radius R of the contacting probe, the analytical model proposed by Forrestal and Longcope [8~17] is modified, and the model parameters for the four different soldering materials are estimated from experimental data .This enables to predict the final penetration depth, and select the shape of the conical probe tip for given contact force and penetration depth.

서지기타정보

서지기타정보
청구기호 {MADE 96026
형태사항 vii, 69 p. : 삽도 ; 26 cm
언어 한국어
일반주기 부록 수록
저자명의 영문표기 : Ick-Hoon Cho
지도교수의 한글표기 : 송지호
지도교수의 영문표기 : Ji-Ho Song
학위논문 학위논문(석사) - 한국과학기술원 : 자동화및설계공학과,
서지주기 참고문헌 : p. 27-29
주제 이동촉침
충격모델
통전검사
Flying probe
Impact modeling
In-circuit testing
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