Plasma etching process is one of the most important processes in semiconductor manufacturing and is operated by process control recipes which are gained through trial and error. It is difficult to apply the classical control theories to the system because it is MIMO, nonlinear and time-varying properties and cannot be easily described by mathematical model. Fuzzy hypercube adaptive algorithm can be applied to it, but it requires much memories and complex software or hardware. The aim of this thesis is to suggest the simpler fuzzy hypercube adaptive control algorithm for the control of the plasma etching system.
