서지주요정보
정전압 하에서의 분무입자 부착 효율에 관한 연구 = A study on deposition efficiency of spray drops in electrostatic field
서명 / 저자 정전압 하에서의 분무입자 부착 효율에 관한 연구 = A study on deposition efficiency of spray drops in electrostatic field / 류성욱.
저자명 류성욱 ; Ryu, Sung-Uk
발행사항 [대전 : 한국과학기술원, 2004].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8014924

소장위치/청구기호

학술문화관(문화관) 보존서고

MME 04026

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초록정보

The present work is to examine the effect of the electric charging on the deposition efficiency of spray drops on a flat metal(copper) plate under an electrostatic field. The spray flow was visualized and the amount of the liquid deposited on the flat metal plate was measured. At the same time trajectories of the spray drops were calculated numerically to confirm the flow behavior. Spray deposition efficiency increased with the higher voltage applied to the atomizer for a fixed liquid flow rate. This is because the electrically changed drops tend to follow the electric-field lines toward the plate, and the effects of the gravity and the motion of the entrained air become minor with the higher voltage input. Also, the momentum of drops prior to collision becomes larger by attraction force between the drops and the plate. Hence the number of the bouncing drops without breaking (by the wall collision) decrease and more drops are disintegrated into smaller ones. Thereby, once the spray drops reach the plate, those tend to remain attached on the surface.

서지기타정보

서지기타정보
청구기호 {MME 04026
형태사항 ix, 88 p. : 삽도 ; 26 cm
언어 한국어
일반주기 부록 수록
저자명의 영문표기 : Sung-Uk Ryu
지도교수의 한글표기 : 김성진
공동교수의 한글표기 : 이상용
지도교수의 영문표기 : Sung-Jin Kim
공동교수의 영문표기 : Sang-Yong Lee
학위논문 학위논문(석사) - 한국과학기술원 : 기계공학전공,
서지주기 참고문헌 : p. 80-82
주제 부착 효율
분무
정전압
액적 경로
반발 현상
deposition efficiency
spray
electrostatic field
drop trajectrories
bouncing phenomenon
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