MCM-OPS is the new part of MCM for RF package. But in this time we can not apply SOPS to Power amplifier Package because of some thermal degradation of active device. So we can take account MEMS technology in SOPS for solving this problem.
The GaAs active Power amplifier device are integrated in etched via hole and attached by Au/Sn eutectic solder, so we can solved thermal problem. The depth of etched via is 150um because the active bare chip is 120um thick and solder is 30um thick. Computed value of thermal resistance of this structure is 3℃/W.