서지주요정보
Liquid Encapsulated Czochralski(LEC)공정의 온도장 전산모사 = Thermal field simulation of LEC process
서명 / 저자 Liquid Encapsulated Czochralski(LEC)공정의 온도장 전산모사 = Thermal field simulation of LEC process / 서민호.
발행사항 [대전 : 한국과학기술원, 1997].
Online Access 원문보기 원문인쇄

소장정보

등록번호

8007511

소장위치/청구기호

학술문화관(문화관) 보존서고

MCHE 97013

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이용가능(대출불가)

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반납예정일

리뷰정보

초록정보

Thermal field is obtained for the Liquid Encapsulated Czochralski(LEC) process by Quasi-Steady State Model(QSSM). The heat transfer mechanism of the model includes the radiational heat transfer between the equipment components' surfaces and convectional heat transfer in melt flow of the crucible. Encapsulant layer is assumed to be totally opaque or transparent. Solutions of the model equations are obtained for the cases in which the crystal and crucible are stationary, as well as they rotate in opposite direction. The surface temperature of the heater satisfying the heat balance including the latent heat generation at the crystal and melt interface is obtained simultaneously with thermal field and velocity field. Surface temperature of the heater in the given radiative heat transfer configuration in the process has strong interaction with the radiational heat flow from the crystal surface and crucible inner wall. Thermal transparency of the encapsulant layer affects the temperature of the crystal near the interface, and the temperature of the heater surface and thermal field in the encapsulant region is dependent on the thermal transparency of encapsulant. Proposed model describing thermal field is easily applicable to next steps such as analysis of thermal stress in the growing crystal, based on assumption of cylindrical crystal geometry, but realization of the crystal and melt interface geometry in the model is indispensable to be used as a tool of process optimization.

서지기타정보

서지기타정보
청구기호 {MCHE 97013
형태사항 vii, 74 p. : 삽화 ; 26 cm
언어 한국어
일반주기 부록 : 실 변수 모델 방정식
저자명의 영문표기 : Min-ho Suh
지도교수의 한글표기 : 이태용
지도교수의 영문표기 : Tai-Yong Lee
학위논문 학위논문(석사) - 한국과학기술원 : 화학공학과,
서지주기 참고문헌 : p. 71-73
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