In the microelectronic packaging, the failure usually occurs in the interfaces. The interface between leadframe(L/F) and EMC(Epoxy Molding Compounds) is one of them. Adhesion strength between L/F and EMC is important factor to prevent failure caused by moisture. In this article, the reaction in the interface between oxidized L/F and EMC is studied.
Copper alloy L/F was oxidized in NaCl(3g/l), NaOH(5g/l), $Na_3PO_412H_2O(10g/l)$ solution at 90℃. This oxidation condition is known as Matt Black Oxide condition and formed $Cu_2O$ on the L/F surfaces. Adhesion strength between L/F and EMC is increased as oxidation time increased but above 6min oxidation time, the adhesion strength was saturated. Reliability of L/F/EMC interface was studied under 85℃/85%R.H. condition, There was no adhesion strength change after 85℃/85%R.H. test in case of untreated L/F but degradation behavior of adhesion strength was showed in case of oxidized L/F.