The fracture toughness of EMC(epoxy molding compound) of two kinds of base epoxy resin is measured under various moisture and temperature conditions, and in addition, it is measured under various loading rate. In this experiment, the compact tension(CT) type specimen is used, and the critical load is measured using a simple mathematical formula. The fracture surface of specimen is investigated by SEM(scanning electron microscope) changing the moisture content ratio, temperature, and loading rate.
The fracture toughness of EMC decreases as the temperature increases in the range between room temperature and 220℃. And the fracture toughness of EMC decreases as the moisture content ratio increases. Unlike the two cases above, the fracture toughness of EMC does not show any apparent trend as the loading rate changes.
The observation of fracture surface of EMC indicates that the fracture pattern does not change as the temperature(or loading rate) changes, but the fracture pattern seems to have close relation with moisture content ratio.