The majority of solder joint research in electronic packaging and surface mount technology(SMT) has concentrated on the integrity and the geometry of the solder joint. In this study, the VOF method to analysis the dynamic behavior of the solder is proposed. And a linearized source method among a number of fixed grid numerical solution techniques for phase change systems is used. The dynamic analysis for molten solder during reflow and wave process is developed for axisymmetric and rectangular coordinates. The solder joint profiles and the times of steady state of molten solder are calculated, and the melting times of the solder are obtained. The results show that the VOF method produce a good agreement with steady state data of the joint profiles and laser can be applied to reflow soldering process.
