Part Ⅰ. The Complex Formation between Helical Poly(L-proline) and Helical Poly(L-glutamic acid) through Hydrogen Bonding: The complex formation between helical Poly-L-glutamic acid (PLGA) and helical Poly-L-proline(PLP) was studied in methanol-water cosolvent in which the ratio of mathanol:water was 2:1 and in propanol-water cosolvent of 9:1. For the study, the reduced viscosity, circular dichroism, pH, and molar absorptivity were measured. The experimental results exhibit that the interpolymer complex was formed between helical PLGA and helical PLP through hydrogen bonding. When the complex was formed, the unit mole ratio of PLGA:PLP(Ⅱ) is 2:1 and PLGA:PLP(Ⅰ) is 1.5:1, the ability of complex formation of PLP(Ⅱ) with PLGA is better than that of PLP(Ⅰ). On complexation the conformations of PLGA and PLP change, the change is more enhanced in PLGA-PLP(Ⅱ) than PLGA-PLP(Ⅰ) complex. The reason will be studied.
Part Ⅱ. High Temperature Polymer Containing Organosilicone Compound
A. The Dispersion of Polymethylsilsesquinoxane into Polyimide : Through the pretreatment of 4, 4'-oxy-dianiline(ODA) with polyhydrogenmethylsiloxane(PHMS) using sodium hydroxide as a catalyst and subsequent reaction of this pretreated PHMS-ODA with 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride(BTDA), polysiloxane can be attached to the polyamic acid by the silyl ester bond. By the thermal treatment of this polysiloxane-polyamic acid compound, well dispersed polymethylsilsesquinoxane(PMSQ) into polyimide can be obtained.
B. Thermal Study for the Crosslinked Organosilicone-Organic Copolymer: we made silicon-oxygen-carbon links by the reaction between dichlomethylvinyl silane and aromatic diol or imide that contains diol. These prepolymer or cyclic oligomer were cured at evaluated temperature. The crosslinking of polyorganosiloxane was achieved by Si-O-Si bond formation through the thermal oxidation of vinyl group that was attached to the silicone. Though the Si-O-C bond is very weak to water, the crosslinked polyoxyarylenesiloxane are stable to boiling water for 36 hours except the surface of the film.
